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Picture
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Part Number |
Manufacturer
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Rohs
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STOCK
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Packing
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Desc
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RFQ
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|---|---|---|---|---|---|---|---|
hongfa
|
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10000
0 |
DIP |
Electronic Component, Compact Design, Enhanced Performance. Supply Voltage: 2.7V to 5.5V. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, Industrial Temperature Range, Easy Integration. Ideal for Aerospace & Defense Applications. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Easy Integration, Stable Output. Suitable for Medical Devices. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, Industrial Temperature Range, High Efficiency. High Current Capability. |
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hongfa
|
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10000
0 |
DIP |
Semiconductor Device, High Reliability. Suitable for Instrumentation. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, Low Noise, Wide Voltage Range. Ideal for Power Electronics. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, Fast Response Time. Ideal for Test & Measurement Equipment. |
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hongfa
|
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10000
0 |
DIP |
Semiconductor Device, High Reliability, Fast Response Time. Designed for Industrial Automation. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, High Efficiency, High Precision. High Current Capability. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Robust Design, Noise Reduction. Enhanced ESD Protection. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, High Frequency Operation, High Reliability. Designed for RF/Microwave Systems. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, Robust Design, Broadband Performance. High Speed Operation. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, Low Distortion, Enhanced Performance. Operating Temperature: -40°C to 85°C. |
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hongfa
|
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10000
0 |
DIP |
Semiconductor Device, High Reliability, Robust Design. Ideal for Audio Equipment. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, High Lineararity. Operating Temperature: -40°C to 85°C. |