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Picture
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Part Number |
Manufacturer
|
Rohs
|
STOCK
|
Packing
|
Desc
|
RFQ
|
|---|---|---|---|---|---|---|---|
|
hongfa
|
 |
10000
0 |
DIP |
Semiconductor Device, High Frequency Operation, Robust Design. High Current Capability. |
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hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, High Lineararity, Compact Design. Designed for Telecommunications. |
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hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, Low Distortion, Robust Design. High Current Capability. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, High Frequency Operation, Robust Design. Suitable for Communication Systems. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Compact Design, Fast Response Time. Ideal for Aerospace & Defense Applications. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Stable Output, Noise Reduction. Low Voltage Dropout. |
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|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, High Lineararity, Enhanced Performance. Operating Temperature: -40°C to 85°C. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, Wide Voltage Range, High Reliability. Designed for Telecommunications. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Fast Response Time, Low Distortion. Ideal for Audio Equipment. |
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|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Industrial Temperature Range, Noise Reduction. Designed for Industrial Automation. |
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|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Industrial Temperature Range. Designed for RF/Microwave Systems. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, High Reliability, Enhanced Performance. Ideal for Aerospace & Defense Applications. |
||
|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Stable Output. High Speed Operation. |
||
|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Noise Reduction. Designed for Telecommunications. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Temperature Stability, Enhanced Performance. Suitable for Instrumentation. |
