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Picture
|
Part Number |
Manufacturer
|
Rohs
|
STOCK
|
Packing
|
Desc
|
RFQ
|
|---|---|---|---|---|---|---|---|
hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Low Noise. Low Voltage Dropout. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, High Reliability, Wide Voltage Range. Low Voltage Dropout. |
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hongfa
|
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10000
0 |
DIP |
Semiconductor Device, High Efficiency, Enhanced Performance. Low Voltage Dropout. |
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hongfa
|
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10000
0 |
DIP |
Semiconductor Device, High Frequency Operation. Ideal for Audio Equipment. |
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hongfa
|
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10000
0 |
DIP |
Semiconductor Device, Broadband Performance. High Current Capability. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Temperature Stability, Broadband Performance. High Speed Operation. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, Fast Response Time. Ideal for Aerospace & Defense Applications. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, High Efficiency. Designed for RF/Microwave Systems. |
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hongfa
|
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10000
0 |
DIP |
Semiconductor Device, Industrial Temperature Range, High Precision. Suitable for Communication Systems. |
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hongfa
|
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10000
0 |
DIP |
Semiconductor Device, High Efficiency, High Accuracy. Low Voltage Dropout. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, High Lineararity, Fast Response Time. Suitable for Communication Systems. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Robust Design, High Lineararity. Ideal for Test & Measurement Equipment. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Robust Design. Designed for Consumer Electronics. |
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hongfa
|
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10000
0 |
DIP |
Semiconductor Device, Easy Integration, Compact Design. Low Voltage Dropout. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, Fast Response Time, Low Power Consumption. Enhanced ESD Protection. |