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Picture
|
Part Number |
Manufacturer
|
Rohs
|
STOCK
|
Packing
|
Desc
|
RFQ
|
|---|---|---|---|---|---|---|---|
hongfa
|
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10000
0 |
DIP |
Semiconductor Device, Enhanced Performance, Industrial Temperature Range. Designed for Telecommunications. |
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hongfa
|
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10000
0 |
DIP |
Semiconductor Device, Low Noise, Wide Voltage Range. High Speed Operation. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, Low Power Consumption, Low Distortion. Suitable for Instrumentation. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, Low Power Consumption, High Efficiency. Suitable for Instrumentation. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, Low Distortion. Suitable for Communication Systems. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Easy Integration. Suitable for Instrumentation. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Easy Integration. Ideal for Aerospace & Defense Applications. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Easy Integration. Enhanced ESD Protection. |
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hongfa
|
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10000
0 |
SOP |
Electronic Component, Temperature Stability. Suitable for Instrumentation. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, High Frequency Operation, Broadband Performance. Ideal for Power Electronics. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, High Efficiency, Noise Reduction. Ideal for Audio Equipment. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, Wide Voltage Range, High Precision. Enhanced ESD Protection. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, Noise Reduction, High Reliability. High Speed Operation. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, Broadband Performance. Suitable for Communication Systems. |
|||
hongfa
|
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10000
0 |
DIP |
Electronic Component, Stable Output, Easy Integration. Enhanced ESD Protection. |