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Part Number |
Manufacturer
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Rohs
|
STOCK
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Packing
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Desc
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RFQ
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|---|---|---|---|---|---|---|---|
hongfa
|
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10000
0 |
DIP |
Semiconductor Device, Compact Design. Suitable for Instrumentation. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, Temperature Stability, Industrial Temperature Range. Suitable for Automotive Electronics. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, Broadband Performance, Robust Design. Designed for RF/Microwave Systems. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, Low Noise, Robust Design. Designed for RF/Microwave Systems. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Broadband Performance, Noise Reduction. Designed for RF/Microwave Systems. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, High Lineararity, Enhanced Performance. Designed for Industrial Automation. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Fast Response Time, Low Power Consumption. Designed for RF/Microwave Systems. |
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hongfa
|
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10000
0 |
DIP |
Semiconductor Device, Low Distortion, Low Noise. Enhanced ESD Protection. |
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hongfa
|
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10000
0 |
DIP |
Semiconductor Device, Low Noise, High Accuracy. Ideal for Test & Measurement Equipment. |
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hongfa
|
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10000
0 |
DIP |
Semiconductor Device, Broadband Performance, Robust Design. Designed for RF/Microwave Systems. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Industrial Temperature Range, Fast Response Time. High Speed Operation. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, High Lineararity, High Frequency Operation. Suitable for Medical Devices. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Temperature Stability. Designed for RF/Microwave Systems. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, High Efficiency. Suitable for Instrumentation. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Stable Output, Low Power Consumption. Designed for Industrial Automation. |