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Part Number |
Manufacturer
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Rohs
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STOCK
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Packing
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Desc
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RFQ
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|---|---|---|---|---|---|---|---|
hongfa
|
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10000
0 |
DIP |
Semiconductor Device, Enhanced Performance, Robust Design. Ideal for Audio Equipment. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, Stable Output, Robust Design. Suitable for Automotive Electronics. |
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hongfa
|
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10000
0 |
DIP |
Semiconductor Device, High Frequency Operation, Low Distortion. Designed for Telecommunications. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Low Noise, High Accuracy. Designed for RF/Microwave Systems. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Industrial Temperature Range, Wide Voltage Range. Operating Temperature: -40°C to 85°C. |
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hongfa
|
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10000
0 |
DIP |
Semiconductor Device, Low Noise, Fast Response Time. Suitable for Communication Systems. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, Compact Design, Robust Design. Suitable for Communication Systems. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, Wide Voltage Range, Broadband Performance. Designed for Telecommunications. |
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hongfa
|
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10000
0 |
DIP |
Semiconductor Device, High Frequency Operation. Ideal for Test & Measurement Equipment. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Noise Reduction. Suitable for Automotive Electronics. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Wide Voltage Range, High Lineararity. High Current Capability. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Noise Reduction. Suitable for Medical Devices. |
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hongfa
|
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10000
0 |
DIP |
Semiconductor Device, Temperature Stability, High Lineararity. Ideal for Audio Equipment. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Broadband Performance, Robust Design. Low Voltage Dropout. |
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hongfa
|
![]() |
10000
0 |
DIP |
Semiconductor Device, Low Noise, Robust Design. Ideal for Test & Measurement Equipment. |