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Picture
|
Part Number |
Manufacturer
|
Rohs
|
STOCK
|
Packing
|
Desc
|
RFQ
|
|---|---|---|---|---|---|---|---|
|
hongfa
|
 |
10000
0 |
DIP |
Electronic Component, Industrial Temperature Range. Suitable for Medical Devices. |
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hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, High Precision, Broadband Performance. Designed for RF/Microwave Systems. |
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|
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hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Low Noise, High Frequency Operation. Designed for RF/Microwave Systems. |
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|
|
hongfa
|
|
10000
0 |
SOP |
Semiconductor Device, Compact Design. Operating Temperature: -40°C to 85°C. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, Temperature Stability, High Accuracy. Ideal for Test & Measurement Equipment. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, High Reliability, Low Power Consumption. Ideal for Audio Equipment. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Temperature Stability. High Current Capability. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Robust Design. Suitable for Communication Systems. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, Wide Voltage Range, Easy Integration. Low Voltage Dropout. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, High Accuracy, Industrial Temperature Range. Ideal for Test & Measurement Equipment. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, High Lineararity. Designed for Industrial Automation. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Enhanced Performance. Suitable for Medical Devices. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Easy Integration, Compact Design. Ideal for Aerospace & Defense Applications. |
||
|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Easy Integration. Suitable for Automotive Electronics. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Low Power Consumption, Temperature Stability. Low Voltage Dropout. |
