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Picture
|
Part Number |
Manufacturer
|
Rohs
|
STOCK
|
Packing
|
Desc
|
RFQ
|
|---|---|---|---|---|---|---|---|
|
hongfa
|
 |
10000
0 |
DIP |
Semiconductor Device, High Accuracy, Industrial Temperature Range. Designed for Telecommunications. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, High Frequency Operation, High Precision. Designed for Telecommunications. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, High Reliability, Compact Design. Suitable for Automotive Electronics. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Low Noise. Designed for RF/Microwave Systems. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Enhanced Performance, Low Noise. Designed for RF/Microwave Systems. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Low Power Consumption, High Reliability. Designed for RF/Microwave Systems. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Compact Design, High Frequency Operation. Ideal for Power Electronics. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Fast Response Time, High Accuracy. Ideal for Audio Equipment. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, High Reliability. Suitable for Medical Devices. |
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|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, Low Distortion, Compact Design. Ideal for Audio Equipment. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, High Lineararity. Designed for Consumer Electronics. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, Fast Response Time, High Efficiency. Designed for Telecommunications. |
||
|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, High Accuracy, Industrial Temperature Range. Suitable for Automotive Electronics. |
||
|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, High Accuracy. Designed for Telecommunications. |
||
|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, Low Noise. Ideal for Aerospace & Defense Applications. |
