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Picture
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Part Number |
Manufacturer
|
Rohs
|
STOCK
|
Packing
|
Desc
|
RFQ
|
|---|---|---|---|---|---|---|---|
|
hongfa
|
 |
10000
0 |
DIP |
Semiconductor Device, Low Distortion, Low Noise. Suitable for Medical Devices. |
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hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Stable Output, High Lineararity. Designed for Industrial Automation. |
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hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Industrial Temperature Range, Enhanced Performance. Designed for Telecommunications. |
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hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Industrial Temperature Range, High Frequency Operation. Suitable for Medical Devices. |
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|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, Fast Response Time. High Current Capability. |
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hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Broadband Performance, Enhanced Performance. Suitable for Automotive Electronics. |
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hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, Low Power Consumption, Wide Voltage Range. Suitable for Automotive Electronics. |
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hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, Stable Output, Low Power Consumption. Enhanced ESD Protection. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, High Lineararity, Low Power Consumption. Suitable for Automotive Electronics. |
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|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Enhanced Performance. Ideal for Aerospace & Defense Applications. |
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hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, High Efficiency, Wide Voltage Range. Ideal for Power Electronics. |
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|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Stable Output, Compact Design. Operating Temperature: -40°C to 85°C. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Low Power Consumption, Fast Response Time. Enhanced ESD Protection. |
||
|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, High Frequency Operation, Low Distortion. Suitable for Medical Devices. |
||
|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Low Distortion. Suitable for Communication Systems. |
