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Picture
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Part Number |
Manufacturer
|
Rohs
|
STOCK
|
Packing
|
Desc
|
RFQ
|
|---|---|---|---|---|---|---|---|
|
hongfa
|
 |
10000
0 |
DIP |
Integrated Circuit, Compact Design. Low Voltage Dropout. |
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hongfa
|
|
10000
0 |
DIP |
Electronic Component, High Efficiency, Robust Design. Suitable for Instrumentation. |
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hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, High Precision, High Reliability. Suitable for Communication Systems. |
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hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, High Precision, Easy Integration. Ideal for Aerospace & Defense Applications. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, Fast Response Time, Broadband Performance. Designed for RF/Microwave Systems. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, High Reliability, High Frequency Operation. Designed for Telecommunications. |
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|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Industrial Temperature Range, Stable Output. Suitable for Instrumentation. |
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|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, Low Noise, Low Power Consumption. Suitable for Medical Devices. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, Easy Integration, Noise Reduction. Enhanced ESD Protection. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Industrial Temperature Range, Easy Integration. Operating Temperature: -40°C to 85°C. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, High Efficiency, Wide Voltage Range. Designed for Consumer Electronics. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, High Precision, Enhanced Performance. Ideal for Aerospace & Defense Applications. |
||
|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, Compact Design, High Efficiency. Supply Voltage: 2.7V to 5.5V. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, High Precision, High Lineararity. Operating Temperature: -40°C to 85°C. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, High Precision, Compact Design. Ideal for Power Electronics. |
