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Picture
|
Part Number |
Manufacturer
|
Rohs
|
STOCK
|
Packing
|
Desc
|
RFQ
|
|---|---|---|---|---|---|---|---|
|
hongfa
|
 |
10000
0 |
DIP |
Semiconductor Device, Fast Response Time, High Reliability. Suitable for Automotive Electronics. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Robust Design, High Reliability. Suitable for Medical Devices. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, High Reliability, High Lineararity. Designed for Consumer Electronics. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Enhanced Performance, Robust Design. High Speed Operation. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Low Noise, Low Distortion. Suitable for Automotive Electronics. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Stable Output, High Frequency Operation. Suitable for Instrumentation. |
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|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Industrial Temperature Range, Low Distortion. High Current Capability. |
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|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Compact Design, Broadband Performance. High Current Capability. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, Stable Output. Suitable for Instrumentation. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Wide Voltage Range, Robust Design. Ideal for Power Electronics. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, Temperature Stability, Industrial Temperature Range. High Current Capability. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Industrial Temperature Range, Compact Design. Ideal for Aerospace & Defense Applications. |
||
|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, High Efficiency, High Frequency Operation. High Current Capability. |
||
|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Industrial Temperature Range, High Reliability. Ideal for Test & Measurement Equipment. |
||
|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, High Lineararity, High Accuracy. Suitable for Medical Devices. |
