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Picture
|
Part Number |
Manufacturer
|
Rohs
|
STOCK
|
Packing
|
Desc
|
RFQ
|
|---|---|---|---|---|---|---|---|
|
hongfa
|
 |
10000
0 |
DIP |
Integrated Circuit, Stable Output. Suitable for Instrumentation. |
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|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, High Frequency Operation. Ideal for Power Electronics. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Low Noise, Stable Output. Operating Temperature: -40°C to 85°C. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Easy Integration, Noise Reduction. Suitable for Medical Devices. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, High Frequency Operation, Compact Design. Ideal for Aerospace & Defense Applications. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, High Reliability. Ideal for Test & Measurement Equipment. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, High Frequency Operation. Ideal for Aerospace & Defense Applications. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Broadband Performance, Temperature Stability. Designed for Consumer Electronics. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, Temperature Stability, Robust Design. Low Voltage Dropout. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Low Distortion, Industrial Temperature Range. Ideal for Audio Equipment. |
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hongfa
|
|
10000
0 |
DIP |
Electronic Component, Enhanced Performance, Fast Response Time. Designed for RF/Microwave Systems. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Compact Design. Ideal for Test & Measurement Equipment. |
||
|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Low Power Consumption. Designed for Telecommunications. |
||
|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, High Reliability, Fast Response Time. High Speed Operation. |
||
|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Broadband Performance. Low Voltage Dropout. |
