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Picture
|
Part Number |
Manufacturer
|
Rohs
|
STOCK
|
Packing
|
Desc
|
RFQ
|
|---|---|---|---|---|---|---|---|
|
hongfa
|
 |
10000
0 |
DIP |
Semiconductor Device, High Precision, Broadband Performance. Designed for Telecommunications. |
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|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, High Lineararity, Industrial Temperature Range. Suitable for Medical Devices. |
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|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Low Distortion, Stable Output. Suitable for Automotive Electronics. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Low Power Consumption, Easy Integration. Ideal for Audio Equipment. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, High Precision, Wide Voltage Range. Ideal for Power Electronics. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Enhanced Performance, Fast Response Time. Low Voltage Dropout. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, High Precision, Compact Design. Suitable for Communication Systems. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, High Efficiency, High Accuracy. Suitable for Medical Devices. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, High Accuracy, Easy Integration. Suitable for Medical Devices. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Industrial Temperature Range, Enhanced Performance. Designed for Industrial Automation. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Robust Design, Stable Output. Ideal for Audio Equipment. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, Compact Design. Designed for Industrial Automation. |
||
|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Low Noise, Industrial Temperature Range. High Current Capability. |
||
|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, High Accuracy, High Efficiency. High Current Capability. |
||
|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Compact Design, Robust Design. Suitable for Instrumentation. |
