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Picture
|
Part Number |
Manufacturer
|
Rohs
|
STOCK
|
Packing
|
Desc
|
RFQ
|
|---|---|---|---|---|---|---|---|
|
hongfa
|
 |
10000
0 |
DIP |
Semiconductor Device, Temperature Stability, Wide Voltage Range. Suitable for Medical Devices. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Robust Design, High Reliability. High Speed Operation. |
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|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Temperature Stability, High Frequency Operation. Ideal for Audio Equipment. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, Low Power Consumption, Broadband Performance. Operating Temperature: -40°C to 85°C. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, High Reliability. Designed for Telecommunications. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Broadband Performance, High Precision. Ideal for Aerospace & Defense Applications. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, High Lineararity, Low Noise. Designed for Consumer Electronics. |
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|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, High Lineararity, Low Distortion. Designed for Telecommunications. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Noise Reduction. Ideal for Audio Equipment. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Enhanced Performance. Designed for RF/Microwave Systems. |
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|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, Low Noise, High Efficiency. Ideal for Aerospace & Defense Applications. |
||
|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Noise Reduction, Low Power Consumption. Operating Temperature: -40°C to 85°C. |
||
|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, Enhanced Performance, High Accuracy. Ideal for Audio Equipment. |
||
|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Temperature Stability, High Frequency Operation. Ideal for Power Electronics. |
||
|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, Compact Design, Low Power Consumption. Operating Temperature: -40°C to 85°C. |
