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Picture
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Part Number |
Manufacturer
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Rohs
|
STOCK
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Packing
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Desc
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RFQ
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|---|---|---|---|---|---|---|---|
hongfa
|
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10000
0 |
SOP |
Integrated Circuit, Temperature Stability, Low Power Consumption. Ideal for Aerospace & Defense Applications. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Low Power Consumption, High Accuracy. High Current Capability. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, High Reliability, Robust Design. Operating Temperature: -40°C to 85°C. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, Broadband Performance. Suitable for Automotive Electronics. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, High Efficiency, Low Noise. Supply Voltage: 2.7V to 5.5V. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, Enhanced Performance. High Current Capability. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, Compact Design, Broadband Performance. Enhanced ESD Protection. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, High Frequency Operation, Fast Response Time. Operating Temperature: -40°C to 85°C. |
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hongfa
|
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10000
0 |
DIP |
Semiconductor Device, High Precision, Compact Design. Designed for Consumer Electronics. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Temperature Stability. Operating Temperature: -40°C to 85°C. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Low Power Consumption, Compact Design. Designed for RF/Microwave Systems. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, Noise Reduction. Ideal for Power Electronics. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, High Accuracy, Broadband Performance. High Speed Operation. |
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hongfa
|
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10000
0 |
DIP |
Semiconductor Device, High Accuracy, Easy Integration. Operating Temperature: -40°C to 85°C. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, High Reliability, Low Distortion. Ideal for Aerospace & Defense Applications. |