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Picture
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Part Number |
Manufacturer
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Rohs
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STOCK
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Packing
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Desc
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RFQ
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|---|---|---|---|---|---|---|---|
hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Wide Voltage Range, High Accuracy. Ideal for Power Electronics. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Broadband Performance, Low Power Consumption. Designed for Telecommunications. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, Fast Response Time, High Precision. Designed for RF/Microwave Systems. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, High Reliability, Temperature Stability. Designed for Telecommunications. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Enhanced Performance, High Efficiency. Designed for Industrial Automation. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, High Accuracy, Low Distortion. Ideal for Aerospace & Defense Applications. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Compact Design, Fast Response Time. Suitable for Instrumentation. |
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hongfa
|
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10000
0 |
DIP |
Semiconductor Device, High Reliability, Temperature Stability. Ideal for Power Electronics. |
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hongfa
|
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10000
0 |
SOP |
Semiconductor Device, Broadband Performance, High Frequency Operation. Suitable for Automotive Electronics. |
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hongfa
|
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10000
0 |
SOP |
Electronic Component, Low Distortion. High Current Capability. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Broadband Performance, Wide Voltage Range. Designed for Telecommunications. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Broadband Performance, Low Power Consumption. Ideal for Aerospace & Defense Applications. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, High Lineararity, High Accuracy. Suitable for Instrumentation. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, High Reliability, Low Noise. Ideal for Aerospace & Defense Applications. |
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hongfa
|
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10000
0 |
DIP |
Semiconductor Device, Low Noise, Fast Response Time. Ideal for Power Electronics. |