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Picture
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Part Number |
Manufacturer
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Rohs
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STOCK
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Packing
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Desc
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RFQ
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|---|---|---|---|---|---|---|---|
hongfa
|
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10000
0 |
DIP |
Electronic Component, Noise Reduction, Temperature Stability. Suitable for Automotive Electronics. |
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hongfa
|
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10000
0 |
DIP |
Semiconductor Device, High Reliability. Low Voltage Dropout. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, High Efficiency, Stable Output. Suitable for Instrumentation. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Low Noise, Noise Reduction. Ideal for Aerospace & Defense Applications. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, High Precision. High Current Capability. |
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hongfa
|
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10000
0 |
DIP |
Semiconductor Device, Stable Output. Designed for Consumer Electronics. |
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hongfa
|
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10000
0 |
DIP |
Semiconductor Device, Industrial Temperature Range, High Reliability. Low Voltage Dropout. |
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hongfa
|
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10000
0 |
DIP |
Semiconductor Device, Broadband Performance, Temperature Stability. High Current Capability. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Industrial Temperature Range, Easy Integration. Ideal for Test & Measurement Equipment. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, High Frequency Operation, Low Power Consumption. Suitable for Instrumentation. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Robust Design, Low Noise. Supply Voltage: 2.7V to 5.5V. |
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hongfa
|
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10000
0 |
DIP |
Semiconductor Device, Temperature Stability. Ideal for Aerospace & Defense Applications. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, High Accuracy, Noise Reduction. Operating Temperature: -40°C to 85°C. |
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hongfa
|
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10000
0 |
DIP |
Semiconductor Device, Stable Output, Easy Integration. Operating Temperature: -40°C to 85°C. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, Low Distortion. High Speed Operation. |