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Picture
|
Part Number |
Manufacturer
|
Rohs
|
STOCK
|
Packing
|
Desc
|
RFQ
|
|---|---|---|---|---|---|---|---|
|
hongfa
|
 |
10000
0 |
DIP |
Semiconductor Device, Temperature Stability, High Accuracy. Suitable for Instrumentation. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Low Power Consumption, High Lineararity. Designed for Telecommunications. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, High Lineararity, Enhanced Performance. Designed for Industrial Automation. |
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|
|
hongfa
|
|
10000
0 |
SOP |
Semiconductor Device, Enhanced Performance. High Speed Operation. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Compact Design, Broadband Performance. Ideal for Aerospace & Defense Applications. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, High Reliability, Stable Output. Low Voltage Dropout. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Fast Response Time, High Reliability. Suitable for Instrumentation. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, Stable Output. Ideal for Audio Equipment. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Wide Voltage Range, Stable Output. Suitable for Communication Systems. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, High Lineararity. Ideal for Aerospace & Defense Applications. |
||
|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, Stable Output. Suitable for Communication Systems. |
||
|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, Compact Design, Industrial Temperature Range. High Speed Operation. |
||
|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, Easy Integration, High Reliability. Designed for RF/Microwave Systems. |
||
|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Industrial Temperature Range, Robust Design. High Current Capability. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, High Frequency Operation. Ideal for Test & Measurement Equipment. |
