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Picture
|
Part Number |
Manufacturer
|
Rohs
|
STOCK
|
Packing
|
Desc
|
RFQ
|
|---|---|---|---|---|---|---|---|
|
hongfa
|
 |
10000
0 |
DIP |
Electronic Component, High Lineararity, Compact Design. Designed for Industrial Automation. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Robust Design. High Current Capability. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Enhanced Performance, Noise Reduction. Suitable for Medical Devices. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Wide Voltage Range, Low Power Consumption. Designed for Telecommunications. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, High Efficiency, Broadband Performance. Ideal for Audio Equipment. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Low Noise, High Precision. High Current Capability. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Robust Design, High Accuracy. Low Voltage Dropout. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Broadband Performance, Easy Integration. Designed for Telecommunications. |
||
|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, Noise Reduction, High Reliability. Suitable for Medical Devices. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Electronic Component, Temperature Stability. Operating Temperature: -40°C to 85°C. |
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|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, High Accuracy. Low Voltage Dropout. |
||
|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Enhanced Performance, Low Power Consumption. Designed for Industrial Automation. |
||
|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Low Noise, Broadband Performance. High Current Capability. |
||
|
|
hongfa
|
|
10000
0 |
DIP |
Semiconductor Device, High Reliability, High Frequency Operation. Ideal for Test & Measurement Equipment. |
||
|
|
hongfa
|
|
10000
0 |
DIP |
Integrated Circuit, Stable Output, High Reliability. Operating Temperature: -40°C to 85°C. |
