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Picture
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Part Number |
Manufacturer
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Rohs
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STOCK
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Packing
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Desc
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RFQ
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|---|---|---|---|---|---|---|---|
hongfa
|
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10000
0 |
DIP |
Integrated Circuit, High Reliability, Noise Reduction. Enhanced ESD Protection. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Robust Design, Wide Voltage Range. Suitable for Automotive Electronics. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Enhanced Performance. Operating Temperature: -40°C to 85°C. |
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hongfa
|
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10000
0 |
DIP |
Semiconductor Device, Temperature Stability, High Reliability. High Speed Operation. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Fast Response Time, Wide Voltage Range. Operating Temperature: -40°C to 85°C. |
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hongfa
|
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10000
0 |
DIP |
Semiconductor Device, Stable Output, Broadband Performance. Ideal for Power Electronics. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, Temperature Stability, Stable Output. High Current Capability. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Industrial Temperature Range. High Current Capability. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Wide Voltage Range, High Accuracy. Designed for Industrial Automation. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, Low Distortion. Supply Voltage: 2.7V to 5.5V. |
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hongfa
|
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10000
0 |
DIP |
Semiconductor Device, Compact Design, Broadband Performance. Designed for Telecommunications. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, Robust Design, High Precision. Ideal for Power Electronics. |
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hongfa
|
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10000
0 |
DIP |
Electronic Component, Low Power Consumption, Low Distortion. High Speed Operation. |
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hongfa
|
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10000
0 |
DIP |
Integrated Circuit, High Lineararity. Enhanced ESD Protection. |
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hongfa
|
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10000
0 |
DIP |
Semiconductor Device, Compact Design, Easy Integration. High Current Capability. |